fastrise™7
Thermally stable, high DK, low loss prepreg
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fastRise™7 is a thermally stable, high DK (7.45 at 10 GHz), low loss prepreg designed to enable the manufacture of high dielectric constant stripline structures at low temperatures. fastRise™ 7 prepreg enables stripline manufacture at 420 °F/215 °C, well below the fabrication temperatures of Low Temperature Co-fired Ceramics (LTCC)
Benefits:
- High 7.45 DK organic prepreg
- Low (420 °F/215 °C) lamination
enables conventional PWB fabrication - Lower cost / reduced weight alternative
to LTCC - Lower cost alternative to fusion bonding
- Enables miniaturization & densification
of high DK RF stripline structures - Compatible with Ticer/Ohmega resistor foils
Applications:
- Military and Avionics (weight reduction)
- Radar Manifolds, Antennas, Fire control
- Filters, Couplers, Power Amplifiers
- Phase Matching Networks
| Product Name | DK+ Tolerance | DF | Data Sheet | Safety Data Sheet | Processing Guidelines | Product Description |
|---|---|---|---|---|---|---|
| fastRise™7 |
7.45 |
0.0030 | Download | Download | Download |
High DK, low loss |