fastRise™EZ
Low temperature curing, low loss flexible prepreg
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fastRise™EZ is a low temperature curing, low loss flexible prepreg/bond ply. FR-EZ is designed to enable the manufacture of complex rigid/flex PWBs containing polyimide (DuPont™ Pyralux® AP/TK flexible circuit materials), LCP or PTFE cores without excessive movement. fastRise™EZ is flexible when thin and can be combined with various flexible or rigid copper clad core materials.
Benefits:
- FR4 lamination temperatures
- Low DK enables reduced PWB thickness
for same impedance - Thermosetting prepreg will not reflow
- Fiberglass-free prepreg
- Compatible with conventional lamination processes
- Can be combined with any core material
- Laser ablatable
Applications:
- High Speed Flex Cables
- Thin Multilayers
- ATE testing
- mmWave Antenna / Automotive
| Product Name | DK+ Tolerance | DF | Data Sheet | Safety Data Sheet | Processing Guidelines | Product Description |
|---|---|---|---|---|---|---|
| fastRise™EZ |
2.32 - 2.51 |
0.0015- 0.0024 |
Download | - | Download |
Low temperature curing, |