fastRise™EZpure
Low temperature curing, thermosetting prepreg
View Product Data Sheet »
fastRise™EZpure is a low temperature curing adhesive for flexible and rigid PWBs. EZpure is a non-reinforced adhesive containing only a low loss thermosetting resin and ceramic additives. EZpure has been optimized to adhere to difficult-to-bond-to substrates like PTFE, polyimide (DuPont™ Pyralux® AP/TK flexible circuit materials) and LCP.
Benefits:
• FR4 lamination temperatures
• Low DK enables reduced PWB
thickness for the same impedance
• Thermosetting prepreg will not reflow
• Fiberglass-free prepreg
• Compatible with conventional
lamination processes
• Can be combined with any core material
• Laser Ablatable
Applications:
• High Speed Flex Cables
• Thin Multilayers
• ATE testing
• mmWave Antenna/Automotive
• Bonding of Subassemblies
| Product Name | DK+ Tolerance | DF | Data Sheet | Safety Data Sheet | Processing Guidelines | Product Description |
|---|---|---|---|---|---|---|
| fastRise™EZpure |
2.8 |
0.0032 | Download | Download |
Low temperature curing, |