FEP
Bonding agent for stripline circuits
FEP bonding film is primarily used as a bond agent between two PTFE circuit boards to form a strip line circuit. Other uses include bonding PTFE laminates to ground planes of various metal types and thicknesses. It is often used in conjunction with lower melt point bond films such as CTFE, where limited sequential lamination is possible. The excellent electrical characteristics of this material make it ideal for circuitry designed for the microwave frequency range. The surface of FEP 200-70 is treated for enhanced bonding characteristics.
Benefits:
- Low loss bonding film
- DK flat over temperature
Applications:
- RF multilayer PCBs
| Product Name | DK+ Tolerance | DF | Data Sheet | Safety Data Sheet | Processing Guidelines | Product Description |
|---|---|---|---|---|---|---|
| FEP |
2.0 |
0.0003 | Download | Download | - |
Thermoplastic bonding film |