TSM-DS3b
Dimensionally Stable Low Loss Laminate
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TSM-DS3b is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3b is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers.
TSM-DS3b was developed for high power applications (TC: 0.65 W/M*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3b was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.
Benefits:
- Industry best DF (DF: 0.0011 @ 10GHz)
- High thermal conductivity
- Low (~5%) fiberglass content
- Dimensional stability rivals epoxy
- Enables large format high layer count PWBs
- Builds complex PWBs in yield with consistency and predictability
- Temperature stable DK +/- 0.25 (-30°C to 120°C)
- Compatible with resistor foils
Applications:
- Couplers
- Phased Array Antennas
- Radar Manifolds
- mmWave Antenna / Automotive
- Oil Drilling
- Semiconductor / ATE Testing
| Product Name | DK+ Tolerance | DF | Data Sheet | Safety Data Sheet | Processing Guidelines | Product Description |
|---|---|---|---|---|---|---|
| TSM-DS3b |
3.0 ± 0.04 |
0.0011 | Download | Download | Download |
Dimensionally stable low |