Solutions » fastRise FR-EZpure
The AGC Solution Guide lets you choose the most suitable product for your intended application.
Low temperature curing, thermosetting prepreg
fastRise™ EZpure is a low temperature curing adhesive for flexible and rigid PWBs. EZpure is a non-reinforced adhesive containing only a low loss thermosetting resin and ceramic additives. EZpure has been optimized to adhere to difficult to-bond-to substrates like PTFE, polyimide (DuPont™ Pyralux® AP/TK flexible circuit materials) and LCP. The primary drawback of polyimides, LCPs and PTFE is the high temperatures normally associated with multilayer fabrication.
Additional Information
| fastRise FR-EZpure |
| 2.8 |
| 0.0032 |
| Download (632.65KB) |
| Download (423.43KB) |
Description
- Low temperature curing, thermosetting prepreg
Benefits
- FR4 lamination temperatures
- Low DK enables reduced PCB thickness for the same impedance
- Fiberglass-free prepreg
- Compatible with conventional lamination processes
- Can be combined with any core material
- Laser Ablatable
Application
- High Speed Flex Cables
- Thin Multilayers
- ATE testing
- mmWave Antenna/Automotive
- Bonding of Subassemblies