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AGC is Attending PCB West to Promote its Range of Digital and RF PCB Substrate Materials
AGC Multi Material America (AMMA) is participating in the PCB West 2024 conference and exhibition in Santa Clara, CA on October 9, 2024.
Visit Booth 303 to learn about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise build-up materials, N7000-3F toughened polyimide, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series. Learn more at our website agc-mutlimaterial.com.
Attend Paul Cooke’s education session on “How PCB Design Affects Fabrication” on Thursday, October 10th at 9:00am.
For more than 30 years PCB West has trained designers, engineers, fabricators and, lately, assemblers, on making printed circuit boards for every product or use imaginable.
We are looking forward to meeting you!