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AGC Showcases Low Loss Materials for the Nex-Gen AI Servers at HKPCA Show 2025
AGC Showcases Low Loss Materials for the Nex-Gen AI Servers at HKPCA Show 2025
AGC Multi Material is participating in the Hong Kong Printed Circuit Association (HKPCA) Show 2025, held at the Shenzhen World Exhibition & Convention Center from December 3 to 5, 2025
Visit us at Hall 8, Booth No.8G01, where we will present our latest innovations in high-performance low loss materials designed to meet the demands of next-generation electronics and AI-driven applications.
Don't miss our technical presentation on Thursday, Decenber 4 at 11:30 AM, where we will introduce new materials engineered for high-speed digital and high-frequency performance.
Featured technologies include:
- METEORWAVE® ELL Series – our most advanced, ultra-low-loss material for next-generation PCB designs, ideal for AI servers in data centers.
- fastRise RCC/BUF/Bond-ply Material – glass cloth free extreme low loss/low CTE materials.
- Advanced CCL for Automotive – tailored for automotive radar sensors and mmWave antennas.
Discover how AGC is enabling the future of electronics through sustainable innovation and material excellence.
Learn more about our products at HKPCA 2025
We look forward to connecting with you in Shenzhen!