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AGC Showcases Low Loss Materials for the Nex-Gen AI Servers at TPCA Show 2025
AGC Multi Material is participating in the Taiwan Printed Circuit Association (TPCA) Show 2025, held at the Taipei Nangang Exhibition Center from October 22 to 24, 2025.
Join us at Booth K429, where we will present our latest innovations in high-performance low loss materials designed to meet the demands of next-generation electronics and AI-driven applications.
Don't miss our technical presentation on Thursday, October 23 at 4:00 PM, where we will introduce new materials engineered for high-speed digital and high-frequency performance.
Featured technologies include:
- METEORWAVE® ELL Series – our most advanced, ultra-low-loss material for next-generation PCB designs, ideal for AI servers in data centers.
- fastRise RCC/BUF/Bond-ply Material – glass cloth free extreme low loss/low CTE materials.
- Advanced CCL for Automotive – tailored for automotive radar sensors and mmWave antennas.
Discover how AGC is enabling the future of electronics through sustainable innovation and material excellence.
Learn more about our products at TPCA Show 2025
We look forward to connecting with you in Taipei!