Solutions » fastRise FR-EZpure

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Low temperature curing, thermosetting prepreg

fastRise™ EZpure is a low temperature curing adhesive for flexible and rigid PWBs. EZpure is a non-reinforced adhesive containing only a low loss thermosetting resin and ceramic additives. EZpure has been optimized to adhere to difficult to-bond-to substrates like PTFE, polyimide (DuPont™ Pyralux® AP/TK flexible circuit materials) and LCP. The primary drawback of polyimides, LCPs and PTFE is the high temperatures normally associated with multilayer fabrication.

Additional Information

Product Name: fastRise FR-EZpure
DK: 2.8
DF: 0.0032
Data Sheet: Download (632.65KB)
Processing Guidelines: Download (423.43KB)


  • Low temperature curing, thermosetting prepreg


  • FR4 lamination temperatures
  • Low DK enables reduced PCB thickness for the same impedance
  • Fiberglass-free prepreg
  • Compatible with conventional lamination processes
  • Can be combined with any core material
  • Laser Ablatable


  • High Speed Flex Cables
  • Thin Multilayers
  • ATE testing
  • mmWave Antenna/Automotive
  • Bonding of Subassemblies

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