Solutions » FR-28-0040-50

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Lowest loss non-reinforced prepreg

fastRise family of prepregs is designed to bond all manner of circuit boards together with the lowest possible loss of any thermosetting prepreg available today.|fastRise family of prepregs is nonreinforced and eliminates skew/ variation in high speed digital/RF circuits. It is based on ceramic fillers, thermoset and PTFE resin, and is ideal for use with AGC's TSM-DS3, TSM-DS3b, TSMDS3M and EZ-IO-F.

Additional Information

Product Name: FR-28-0040-50
DK: 2.76
DF: 0.0014
Data Sheet: Download (840.85KB)
Processing Guidelines: Download (2.21MB)

Description

  • Lowest loss non-reinforced prepreg

Benefits

  • DF = 0.0014 / 0.0017 (10/40 GHz)
  • Laser ablatable, HDI ready
  • Low Dk enables reduced thickness of ATE boards
  • Low temperature alternative to thermoplastic films in avionics and aerospace designs
  • Multilayer prepreg for high layer count high speed digital
  • Stable Dk over temperature
  • Fiberglass free prepreg
  • Enables 5+ sequential laminations
  • Compatible with conductive pastes between subassemblies

Application

  • Filters & Couplers
  • Avionics and Aerospace
  • Automotive Radar
  • Beam Steerable Antenna
  • Flexible Circuits