Solutions » FR-EZpure

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Low temperature curing, thermosetting prepreg

Additional Information

Product Name: FR-EZpure
DK: 2.8
DF: 0.0032
Data Sheet: Download (1.06MB)
Processing Guidelines: Download (423.43KB)

Description

  • Low temperature curing, thermosetting prepreg

Benefits

  • FR4 lamination temperatures
  • Low DK enables reduced PCB thickness for the same impedance
  • Fiberglass-free prepreg
  • Compatible with conventional lamination processes
  • Can be combined with any core material
  • Laser Ablatable

Application

  • High Speed Flex Cables
  • Thin Multilayers
  • ATE testing
  • mmWave Antenna/Automotive
  • Bonding of Subassemblies