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Thin dielectric base material for couplers

TLE laminates are engineered to provide electrical and mechanical properties to meet the requirements of complex microwave and high speed digital applications. The low Z-axis CTE provides excellent plated through hole reliability while the low thermal expansion properties in the X and Y plane ensure high reliability in surface mount applications. The Dk exhibits minimal change over temperature.

Additional Information

Product Name: TLE-95
DK: 2.95 +/- 0.05
DF: 0.0026
Data Sheet: Download (460.29KB)
Processing Guidelines: Download (462.68KB)


  • Thin dielectric base material for couplers


  • Low CTE value
  • Controlled dimensional stability
  • Low DF
  • Low & stable DK
  • High flexural strength
  • UL 94 V-O rating


  • Microwave radios
  • Satellite antenna systems
  • Passive components
  • High layer count multilayer pcbs
  • High speed chip test multilaye rpcbs