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Dimensionally stable low loss laminate

TSM-DS3M is a thermally stable, industry leading low loss core (DF = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3M is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers. TSM-DS3M was developed for high power applications (TC: 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3M was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.

Additional Information

Product Name: TSM-DS3M
DK: 2.94 +/- 0.04
DF: 0.0014
Data Sheet: Download (310.40KB)
Processing Guidelines: Download (0.97MB)


  • Dimensionally stable low loss laminate


  • Industry best DF (DF: 0.0011 @ 10GHz)
  • High thermal conductivity
  • Low Z axis expansion for avionics and aerospace applications
  • Low (~5 %) fiberglass content
  • Dimensional stability rivals epoxy
  • Enables large format high layer count PWBs
  • Builds complex PWBs in yield with consistency and predictability
  • Temperature stable DK +/- 0.25 (-30 °C to 120 °C)
  • Compatible with resistive foils


  • Microstrip and stripline circuitry for avionics and aerospace applications
  • Couplers
  • Phased Array Antennas
  • Radar Manifolds
  • mmWave Antenna
  • Oil Drilling
  • Semiconductor / ATE Testing

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