Industry-Leading SI Performance
- Ideal for next-generation, high-speed, and high-frequency applications including 800G/1.6T systems.
- Proven top-of-class SI performance compared to competitor materials even with lower grade glass fabric.
METEORWAVE® ELL Series for
High-Speed, Extreme Low-Loss,
High-Reliability Applications
AGC offers thermoset copper clad laminates and prepregs with industry-leading SI performance, delivering extremely low loss and high thermal reliability. We provide an optimal product lineup to meet a wide range of PCB material requirements, especially for 800G/1.6T high-speed, high-frequency communication applications.
Strengths of the ELL Series
Flexible Glass Cloth Selection
- Multiple reinforcement grades are available for different SI requirements: Low Dk1 (NE), Low Dk2 (NER), and Q glass.
- Excellent SI performance even with Low Dk1 glass, enabling stable supply, good processability, and higher manufacturing yield.
Consistent product design based on AGC's proprietary materials technology
- Suitable for hybrid design with compatible resin chemistry, which ensures good processability and material homogeneity.
Excellent Low-CTE Performance
- Enhances PCB thermal reliability and helps reduce warpage during PCB fabrication and assembly.
Challenges Faced by PCB Manufacturers
Meeting the Demands of 800G/1.6T
High-Speed Networks
Rapid growth in AI and data centers is driving massive increases in data traffic, requiring higher SI performance from PCB materials.
SI Performance (Microstrip Line)Managing Increasing
PCB Design Complexity
Today's most advanced PCB designs increasingly require complex stack-ups, hybrid material constructions, and diverse material combinations.
Thermal Expansion BehaviorResin Filling Performance with 2 oz Copper
Sequential Lamination Performance
Achieving High PCB Reliability
Robust reliability is required throughout qualification and production to meet demanding end-use requirements.
PCB Reliability Test ResultsEnsuring Material Supply Stability
Securing a stable material supply while balancing performance and cost has become a critical challenge.
ELL Product LineupKey Features of the ELL Series
Product Properties
| Product Name | Resin System | Base Material | Dk | Dk Range | Df | Tg (°C) | IPC 4101E Slash Sheet |
Application |
|---|---|---|---|---|---|---|---|---|
| Meteorwave® E2 |
Proprietary Thermoset | Laminate; Prepreg / Bond Ply / Bond Film | 3.2 | 3.0 ~ 3.5 | 0.0012 | 210 | 4103A/540 | Wireless; Avionics & Aerospace; Server / Router; Semiconductor ATE; Automotive |
| Meteorwave® E3 |
Proprietary Thermoset | Laminate; Prepreg / Bond Ply / Bond Film | 3.1 | 3.0 ~ 3.5 | 0.0010 | 200 | 4103A/540 | Wireless; Avionics & Aerospace; Server / Router; Semiconductor ATE; Automotive |
| Meteorwave® ELL 202 |
Proprietary Thermoset | Laminate; Prepreg / Bond Ply / Bond Film | 3.2 | 3.0 ~ 3.5 | 0.0009 | 210 | 4103A/540 | Wireless; Avionics & Aerospace; Server / Router; Semiconductor ATE; Automotive |
| Meteorwave® ELL 205 |
Proprietary Thermoset | Laminate; Prepreg / Bond Ply / Bond Film | 3.1 | 3.0 ~ 3.5 | 0.0007 | 210 | 4103A/540 | Wireless; Avionics & Aerospace; Server / Router; Semiconductor ATE; Automotive |
| Meteorwave® ELL 302 |
Proprietary Thermoset | Laminate; Prepreg / Bond Ply / Bond Film | 3.1 | 3.0 ~ 3.5 | 0.0008 | 200 | 4103A/540 | Wireless; Avionics & Aerospace; Server / Router; Semiconductor ATE; Automotive |
| Meteorwave® ELL 305 |
Proprietary Thermoset | Laminate; Prepreg / Bond Ply / Bond Film | 3.0 | 3.0 ~ 3.5 | 0.0005 | 200 | 4103A/540 | Wireless; Avionics & Aerospace; Server / Router; Semiconductor ATE; Automotive |
*The values shown are typical values and are not guaranteed.
Technical Resources
We provide the following technical resources.
- TDS, Dk table, SDS, Processing guidelines, Outgassing data, IPC Slash Sheet Reference, UL CTI Rating etc.
- Evaluation Samples
- Pathway to specification consultation
- Documents to support your evaluation
Please contact us
through the Inquiry form below for
the technical resources.
Inquiry Form
For more information about our product solutions,
please contact us.
Our team can support grade comparison, technical data requests,
and consultation for mass-production use.