Solutions » RF-10

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Low loss, high DK material

RF-10 copper clad laminates are composites of ceramic filled PTFE and woven fiberglass. RF-10 has the advantage of high dielectric constant and low dissipation factor. Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.

Additional Information

Product Name: RF-10
DK: 10.2 +/- 0.3
DF: 0.0025
Data Sheet: Download (275.02KB)
Processing Guidelines: Download (626.07KB)


  • Low loss, high DK material


  • High DK for RF circuit size reduction
  • Excellent dimensional stability
  • Tight DK tolerance (10.2 +/-0.3)
  • Low 0.0025 loss tangent @ 10 GHz
  • High thermal conductivity for enhanced thermal management
  • Excellent adhesion to smooth coppers
  • Low X, Y, Z expansion
  • Excellent price/performance ratio


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